Munkang Choi, : rechercher sur Z-Library

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1

[IEEE 2012 International Silicon-Germanium Technology and Device Meeting (ISTDM) - Berkeley, CA, USA (2012.06.4-2012.06.6)] 2012 International Silicon-Germanium Technology and Device Meeting (ISTDM) - 14 nm FinFET Stress Engineering with Epitaxial SiGe Source/Drain

Choi, Munkang, Moroz, Victor, Smith, Lee, Penzin, Oleg

Année:

2012

Langue:

english

Fichier:

PDF, 853 KB

english, 2012

2

The Impact of Defects on GaN Device Behavior: Modeling Dislocations, Traps, and Pits

Moroz, Victor, Wong, Hiu Yung, Choi, Munkang, Braga, Nelson, Mickevicius, R. V., Zhang, Yuhao, Palacios, Thomas

Journal:

ECS Journal of Solid State Science and Technology

Année:

2016

Langue:

english

Fichier:

PDF, 1.33 MB

english, 2016

3

Study of Area Scaling Effect on Integrated Circuit Reliability Based on Yield Models

Changsoo Hong, Linda Milor, Munkang Choi, Tom Lin

Journal:

Microelectronics Reliability

Année:

2005

Langue:

english

Fichier:

PDF, 656 KB

english, 2005

4

Modeling Evolution of Temperature, Stress, Defects, and Dopant Diffusion in Silicon During Spike and Millisecond Annealing

Moroz, Victor, Martin-Bragado, Ignacio, Zographos, Nikolas, Matveev, Dmitri, Zechner, Christoph, Choi, Munkang

Journal:

MRS Proceedings

Année:

2008

Langue:

english

Fichier:

PDF, 3.44 MB

english, 2008

5

[IEEE 2015 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) - Washington DC, USA (2015.9.9-2015.9.11)] 2015 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) - FinFET to nanowire transition at 5nm design rules

Smith, Lee, Munkang Choi,, Frey, Martin, Moroz, Victor, Ziegler, Anne, Luisier, Mathieu

Année:

2015

Langue:

english

Fichier:

PDF, 725 KB

english, 2015

6

[IEEE 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Modeling Performance and Thermal Induced Reliability Issues of a 3nm FinFET Logic Chip Operation in a Fan-Out and a Flip-Chip Packages

Choi, Munkang, Xu, Xiaopeng, Moroz, Victor

Année:

2019

Fichier:

PDF, 1.19 MB

2019

7

Effectiveness of Stressors in Aggressively Scaled FinFETs

Nuo Xu, Ho, B., Munkang Choi, Moroz, V., Liu, T.-J.K.

Journal:

IEEE Transactions on Electron Devices

Année:

2012

Langue:

english

Fichier:

PDF, 1.40 MB

english, 2012

8

[IEEE 2003 46th Midwest Symposium on Circuits and Systems - Cairo, Egypt (27-30 Dec. 2003)] 2003 46th Midwest Symposium on Circuits and Systems - High speed phase detector design

Cheng Jia,, Munkang Choi,, Milor, L., Sheng-Feng Ho,, Hong-Yi Huang,

Année:

2003

Langue:

english

Fichier:

PDF, 661 KB

english, 2003

9

Impact on circuit performance of deterministic within-die variation in nanoscale semiconductor manufacturing

Munkang Choi, Milor, L.

Journal:

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Année:

2006

Langue:

english

Fichier:

PDF, 923 KB

english, 2006

10

Diagnosis of Optical Lithography Faults With Product Test Sets

Munkang Choi, Milor, L.

Journal:

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Année:

2008

Langue:

english

Fichier:

PDF, 1.36 MB

english, 2008

11

[IEEE 2012 IEEE International Electron Devices Meeting (IEDM) - San Francisco, CA, USA (2012.12.10-2012.12.13)] 2012 International Electron Devices Meeting - Is strain engineering scalable in FinFET era?: Teaching the old dog some new tricks

Nainani, Aneesh, Gupta, Shashank, Moroz, Victor, Choi, Munkang, Kim, Yihwan, Cho, Yonah, Gelatos, Jerry, Mandekar, Tushar, Brand, Adam, Ping, Er-Xuan., Abraham, Mathew C., Schuegraf, Klaus

Année:

2012

Langue:

english

Fichier:

PDF, 641 KB

english, 2012

12

[IEEE 2012 IEEE International SOI Conference - Napa, CA, USA (2012.10.1-2012.10.4)] 2012 IEEE International SOI Conference (SOI) - Effectiveness of strained-Si technology for thin-body MOSFETs

Xu, Nuo, Shin, Changhwan, Andrieu, Francois, Ho, Byron, Xiong, Wade, Weber, Olivier, Poiroux, Thierry, Nguyen, Bich-Yen, Choi, Munkang, Moroz, Victor, Faynot, Olivier, Liu, Tsu-Jae King

Année:

2012

Langue:

english

Fichier:

PDF, 1.12 MB

english, 2012

13

[IEEE IEEE International Conference on Simulation of Semiconductor Processes and Devices - Boston, MA, USA (2003.09.3-2003.09.5)] International Conference on Simulation of Semiconductor Processes and Devices, 2003. SISPAD 2003. - Simulation of the circuit performance impact of lithography in nanoscale semiconductor manufacturing

Munkang Choi,, Milor, L., Capodieci, L.

Année:

2003

Langue:

english

Fichier:

PDF, 346 KB

english, 2003

14

Intentional Distortion of Transistor Shape to Improve Circuit Performance

Moroz, V., Munkang Choi,, Xi-Wei Lin,

Journal:

IEEE Electron Device Letters

Année:

2010

Langue:

english

Fichier:

PDF, 295 KB

english, 2010

15

Exploring doping options and variability of trigate transistors using atomistic process and device simulations

Martin-Bragado, Ignacio, Moroz, Victor, Choi, Munkang

Journal:

Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures

Année:

2010

Langue:

english

Fichier:

PDF, 631 KB

english, 2010

16

ECS Transactions [ECS 218th ECS Meeting - Las Vegas, NV (October 10 - October 15, 2010)] - (Invited) Strain Scaling and Modeling for FETs

Moroz, Victor, Choi, Munkang

Année:

2010

Langue:

english

Fichier:

PDF, 775 KB

english, 2010

17

ECS Transactions [ECS 218th ECS Meeting - Las Vegas, NV (October 10 - October 15, 2010)] - (Invited) Impact of Stress and Defects on Advanced Junction Leakage

Moroz, Victor, Choi, Munkang

Année:

2010

Langue:

english

Fichier:

PDF, 994 KB

english, 2010

18

[IEEE 2014 IEEE International Electron Devices Meeting (IEDM) - San Francisco, CA, USA (2014.12.15-2014.12.17)] 2014 IEEE International Electron Devices Meeting - Modeling and optimization of group IV and III–V FinFETs and nano-wires

Moroz, Victor, Lee Smith,, Joanne Huang,, Munkang Choi,, Ma, Terry, Jie Liu,, Yunqiang Zhang,, Xi-Wei Lin,, Kawa, Jamil, Saad, Yves

Année:

2014

Langue:

english

Fichier:

PDF, 4.11 MB

english, 2014

19

[IEEE 2015 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) - Washington DC, USA (2015.9.9-2015.9.11)] 2015 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) - Extending drift-diffusion paradigm into the era of FinFETs and nanowires

Munkang Choi,, Moroz, Victor, Smith, Lee, Joanne Huang,

Année:

2015

Langue:

english

Fichier:

PDF, 771 KB

english, 2015

20

[IEEE 2006 16th Biennial University/Government/Industry Microelectronics Symposium - San Jose, CA (2006.6.25-2006.6.28)] 2006 16th Biennial University/Government/Industry Microelectronics Symposium - Effect of Process and Layout on Strain Enhancement from Dual Stress Liners

Moroz, V., Munkang Choi,, Xi Wie Lin,, Pramanik, D.

Année:

2006

Langue:

english

Fichier:

PDF, 34 KB

english, 2006

21

[IEEE 2015 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) - Washington DC, USA (2015.9.9-2015.9.11)] 2015 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) - Power-performance-area engineering of 5nm nanowire library cells

Moroz, Victor, Lin, Xi-Wei, Smith, Lee, Huang, Joanne, Choi, Munkang, Ma, Terry, Liu, Jie, Zhang, Yunqiang, Kawa, Jamil, Saad, Yves

Année:

2015

Langue:

english

Fichier:

PDF, 623 KB

english, 2015

22

SPIE Proceedings [SPIE SPIE Advanced Lithography - San Jose, California, USA (Sunday 22 February 2009)] Design for Manufacturability through Design-Process Integration III - Systematic study of the impact of curved active and poly contours on transistor performance

Singh, Vivek K., Moroz, Victor, Choi, Munkang, Rieger, Michael L., Lin, Xi-Wei

Année:

2009

Langue:

english

Fichier:

PDF, 1.19 MB

english, 2009

23

[IEEE 2017 IEEE Electron Devices Technology and Manufacturing Conference (EDTM) - Toyama, Japan (2017.2.28-2017.3.2)] 2017 IEEE Electron Devices Technology and Manufacturing Conference (EDTM) - FinFET/nanowire design for 5nm/3nm technology nodes: Channel cladding and introducing a “bottleneck” shape to remove performance bottleneck

Moroz, Victor, Huang, Joanne, Choi, Munkang

Année:

2017

Langue:

english

Fichier:

PDF, 2.87 MB

english, 2017

24

Comparative Analysis of Semiconductor Device Architectures for 5-nm Node and Beyond

Feng, Peijie, Song, Seung-Chul, Nallapati, Giri, Zhu, John, Bao, Jerry, Moroz, Victor, Choi, Munkang, Lin, Xi-Wei, Lu, Qiang, Colombeau, Benjamin, Breil, Nicolas, Chudzik, Michael, Chidambaram, Chidi

Journal:

IEEE Electron Device Letters

Année:

2017

Langue:

english

Fichier:

PDF, 1.11 MB

english, 2017

25

Kinetic Velocity Model to Account for Ballistic Effects in the Drift-Diffusion Transport Approach

Penzin, Oleg, Smith, Lee, Erlebach, Axel, Choi, Munkang, Lee, Ko-Hsin

Journal:

IEEE Transactions on Electron Devices

Année:

2017

Langue:

english

Fichier:

PDF, 960 KB

english, 2017